Component carrier

ABSTRACT

The invention provides a structure and method of its use comprising a filtering and interference suppression device ( 62 ), particularly of the broad band type, for an electric motor ( 34 ) comprising at least a first powering brush ( 16 ) for an armature commutator of the electric motor ( 34 ), of the type comprising a capacitor ( 64 ), one terminal of which is electrically connected to a strip conductor ( 38 ) that electrically powers the first brush ( 16 ) powering the armature commutator of the electric motor ( 34 ), and the other terminal of which is electrically connected to a ground strip conductor ( 58 ), connected, in turn, to the electrical ground ( 60 ) of the electric motor ( 34 ), characterized in that the capacitor ( 72 ) of the filtering and interference suppression device ( 62 ) is of the non-inductive type, and in that each of the non-inductive capacitors ( 72 ) is directly attached to a circuit board ( 73 ) comprising strip conductors, of which are at least one powering strip conductor ( 38, 40 ) for a brush and one ground strip conductor ( 58 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of PCT/US99/07653, filed Apr.6, 1999, which was published as WO 99/52210 on Oct. 14, 1999, which is acontinuation-in-part of application Ser. No. 09/056,436 filed Apr. 7,1998; and PCT/US99/07653, filed Apr. 6, 1999, claims the benefit of U.S.Provisional Application No. 60/101,511 filed Sep. 23, 1998 and U.S.Provisional Application No. 60/103,759 filed Oct. 9, 1998.

This application also incorporates by reference the entirety of thedisclosure of United States patent application publication 20030048029,which is a publication of U.S. patent application Ser. No. 10/239,983,which is a United States national stage proceeding of PCT applicationnumber PCT/FR01/00969, filed Mar. 20, 2001, entitled “Filtering andinterference suppressing device for an electric motor,” and which namesas alleged inventors DeDaran, Francois; (Chatellerault, F R); Bruneau,Severin; (Chatellerault, F R); Rouyer, Philippe; (Chatellerault, F R);Salembere, Abdou; (Chatellerault, F R).

This application also incorporates by reference the disclosure ofPCT/US99/07653, 09/056,436, 60/101,511, and 60/103,759.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates to electronic component carriers used inthe manufacture of electronic equipment. More specifically, theinvention relates to component carrier substrates used to protectelectronic components from mechanical stresses associated with theirhandling and coupling within electronic equipment. The component carriersubstrates also provide electrical interference shielding and improvedthermal characteristics.

2. Discussion of the Background

The majority of electronic equipment produced presently, and inparticular computers, communication systems, military surveillanceequipment, stereo and home entertainment equipment, televisions andother appliances include miniaturized components to perform new highspeed functions and electrical interconnections which according to thematerials from which they are made or their mere size are verysusceptible to stray electrical energy created by electromagneticinterference or voltage transients occurring on electrical lines.Voltage transients can severely damage or destroy such micro-electroniccomponents or contacts thereby rendering the electronic equipmentinoperative, and requiring extensive repair and/or replacement at greatcost.

Based upon the foregoing there was found a need to provide amulti-functioning electronic component architecture which attenuateselectromagnetic emissions resulting from differential and common modecurrents flowing within electronic circuits, single lines, pairs oflines and multiple twisted pairs. Such multi-functioning electroniccomponents are the subject of application Ser. No. 08/841,940,continuation-in-part application Ser. No. 09/008,769, andcontinuation-in-part application Ser. No. 09/056,379, all incorporatedherein by reference.

While the above referenced electronic components accomplish theirrespective tasks, usage of such components has been limited for a numberof reasons. First, the number of such components required continues toincrease as applications, such as data buses, continue to grow. Inaddition, as the number of required components grows, so does thephysical size of multi-component packages. Second, by their nature theelectronic components referred to are delicate structures which do nothandle physical stress well. During the manufacture of electronicproducts a number of mechanical stresses associated with handling andsoldering can damage the components.

Another drawback to using the referenced electronic components is thatit becomes very tedious to manually handle and mount the components onelectronic products being assembled. This often time translates intolower product yields and added expense due to broken or misconnectedcomponents. A further disadvantage to some of the components is thatthey include leads for thru-hole insertion. Physical stressing, bendingor applying torque to the leads can cause a failure in the finalproduct, either immediately or later thereby affecting the productsoverall reliability.

Another source of electrical noise found in prior art differential modefilters, common mode filters and capacitor decouplers is caused byimperfections in the capacitors that make up the filters and decouplers.The effects of these imperfections are commonly referred to as parasiticeffects. Parasitic or non-ideal capacitor behavior manifests itself inthe form of resistive and inductive elements, nonlinearity anddielectric memory. The four most common effects are leakage or parallelresistance, equivalent series resistance (ESR), equivalent seriesinductance (ESL) and dielectric absorption. The equivalent seriesresistance (ESR) of a capacitor is the resistance of the capacitor leadsin series with the equivalent resistance of the capacitor plates. ESRcauses the capacitor to dissipate power during high flowing ac currents.The equivalent series inductance (ESL) of a capacitor is the inductanceof the capacitor leads in series with the equivalent inductance of thecapacitor plates. An additional form of parasitic that goes beyond thecomponent itself is stray capacitance which is attributed to theattachment of the capacitor element within an electrical circuit. Straycapacitors are formed when two conductors are in close proximity to eachother and are not shorted together or screened by a Faraday shield.Stray capacitance usually occurs between parallel traces on a PC boardor between traces/planes on opposite sides of a PC board. Straycapacitance can cause problems such as increased noise and decreasedfrequency response.

Several other sources of electrical noise include cross talk and groundbounce.

Cross talk in most connectors or carriers is usually the result ofmutual inductance between two adjacent lines rather than from parasiticcapacitance and occurs when signal currents follow the path of leastinductance, especially at high frequencies, and return or couple ontonearby conductors such as conductive tracks positioned parallel with orunderneath the signal current track. Ground bounce is caused by shiftsin the internal ground reference voltage due to output switching of acomponent. Ground bounce causes false signals in logic inputs when adevice output switches from one state to another. It has been found thatthe multi-functioning electronic components, specifically thedifferential and common mode filters and decouplers disclosed in theabove referenced, commonly owned U.S. patent applications, provideimproved performance when coupled or used with an enlarged ground shieldthat can substantially decrease or reduce and in some cases caneliminate capacitor parasitics, stray capacitance, mutual inductivecoupling between two opposing conductors, various forms of cross talkand ground bounce.

Therefore, in light of the foregoing deficiencies in the prior art, theapplicant's invention is herein presented.

SUMMARY OF THE INVENTION

Based upon the foregoing, there has been found a need to provide acomponent carrier which is less susceptible to mechanical stresses andshock, more easily assembled, surface mountable and capable of beingused in automated assembly.

It is therefore a main object of the present invention to provide acomponent carrier for maintaining one or more surface mount components.

It is another object of the present invention to provide a componentcarrier which is less susceptible to mechanical stresses imparted uponcomponents during various manufacturing processes.

It is also an object of the present invention to provide a componentcarrier having an enhanced ground surface which improves the functionalcharacteristics of surface mount components coupled to the componentcarrier.

It is a further object of the present invention to provide a componentcarrier adapted specifically to receive a differential and common modefilter and decoupler as disclosed in the above referenced, commonlyowned pending U.S. patent applications.

It is a further object of the present invention to provide a componentcarrier having an enhanced ground surface which improves the functionalcharacteristics of differential and common mode filters and decouplersas disclosed in the above referenced, commonly owned pending U.S. patentapplications.

It is a further object of the present invention to provide an electricalcircuit conditioning assembly that combines a component carrier with adifferential and common mode filter and decoupler as disclosed in theabove referenced, commonly owned pending U.S. patent applications tothereby provide simultaneous filtering of common and differential modeinterference, suppression of parasitic or stray capacitance, mutualinductive coupling between two adjacent conductors and circuitdecoupling from a single assembly.

These and other objects and advantages of the present invention areaccomplished through the use of various embodiments of a componentcarrier which receives either a thru-hole or surface mount differentialand common mode filter and decoupler as disclosed in the abovereferenced, commonly owned pending U.S. patent applications (hereinafterreferred to only as “differential and common mode filter”).

One embodiment consists of a plate of insulating material, also referredto as a planar insulator, having a plurality of apertures for acceptingthe leads of a thru-hole differential and common mode filter. Anotherembodiment consists of a surface mount component carrier comprised of adisk of insulating material having at least two apertures.

The disk is substantially covered by a metalized ground surface andincludes at least two conductive pads surrounding the apertures, andinsulating bands which surround each conductive pad. The insulatingbands separate and electrically isolate the conductive pads from themetalized ground surface. A surface mount component, such as adifferential and common mode filter, is positioned lengthwise betweenthe two conductive pads and operably coupled to the carrier. Once thesurface mount component is coupled to the carrier, the combination canbe manipulated, either manually or through various types of automatedequipment, without subjecting the surface mount component to mechanicaland physical stresses normally associated with the handling of miniaturecomponents.

The carrier also provides the added benefit of improved shielding fromelectromagnetic interference and over voltage dissipation due to thesurface area of the metalized ground surface.

The same concept for the above described carrier is also incorporatedinto several alternate embodiments, either independently, embeddedwithin electronic connectors or configured for use with electric motors.The overall configuration and electrical characteristics of the conceptsunderlying the present inventions are also described as an electricalcircuit conditioning assembly which encompasses the combination ofdifferential and common mode filters and component carriers optimizedfor such filters.

These along with other objects and advantages of the present inventionwill become more readily apparent from a reading of the detaileddescription taken in conjunction with the drawings and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective, exploded view of a thru-hole differential andcommon mode filter coupled to a portion of the thru-hole componentcarrier of the present invention;

FIG. 2 is an elevational view in cross section of a single-sided surfacemount component carrier of the present invention;

FIG. 3 is a top plan view of the surface mount component carrier shownin FIG. 2;

FIG. 4 is an elevational view in cross section of a double-sided surfacemount component carrier of the present invention;

FIG. 5 is a top plan view of the surface mount component carrier shownin FIG. 4;

FIG. 6 is an elevational view in cross section of an alternateembodiment of a single-sided surface mount component carrier of thepresent invention;

FIG. 7 is a top plan view of the surface mount component carrier shownin FIG. 6;

FIG. 8 is an elevational view in cross section of an alternateembodiment of a double-sided surface mount component carrier of thepresent invention;

FIG. 9 is a top plan view of the surface mount component carrier shownin FIG. 8;

FIGS. 10A and 10B are top plan views of a surface mount componentcarrier with and without a differential and common mode filter, as shownin FIG. 10C, attached to the component carrier; FIG. 10D is a top planview of a multi surface mount component carrier with differential andcommon mode filters;

FIG. 11A is a top plan view of a multi surface mount component carrierwith and without differential and common mode filters coupled to thecomponent carrier, wherein the component carrier is optimized for use ina D-sub connector assembly; FIG. 11 B is an elevational view in crosssection of the component carrier along lines A-A; and FIG. 11 C is anelevational view in cross section of the component carrier along linesB-B;

FIG. 12A is a top plan view of a surface mount component carrier with astrip differential and common mode filter partially shown coupled to thecomponent carrier, wherein the component carrier is optimized for use inan RJ-45 connector assembly; FIG. 12B is a bottom plan view of thecomponent carrier shown in FIG. 12A; and FIG. 12C is an elevational viewin cross section of the component carrier shown in FIG. 12A along linesA-A;

FIG. 13A is a top plan view of an alternate surface mount componentcarrier, wherein the component carrier is optimized for use in an RJ-45connector assembly; FIG. 13B is a bottom plan view of the componentcarrier shown in FIG. 13A; and FIG. 13C is an elevational view in crosssection of the component carrier shown in FIG. 13A along lines A-A;

FIG. 14A is a top plan view of a multi surface mount component prototypecarrier;

FIG. 14B is an elevational view in cross section of the componentcarrier shown in FIG. 14A along lines A-A; FIG. 14C is an elevationalview in cross section of the component carrier shown in FIG. 14A alonglines B-B; and FIG. 14D is a bottom plan view of the component carriershown in FIG. 14A;

FIG. 15 is a perspective view of a connector carrier of the presentinvention;

FIG. 16 is a top plan view of the connector carrier shown in FIG. 15;

FIG. 17 is a perspective view of a standard connector shell;

FIG. 18 is an exploded perspective view of the connector carrier of thepresent invention in operable cooperation with a standard connectorshell and a multi-conductor differential and common mode filter;

FIG. 19 is a partial perspective view of a further embodiment of aconnector surface mount differential and common mode filter carrier ofthe present invention;

FIG. 20 is a partial top plan view of the connector surface mountdifferential and common mode carrier shown in FIG. 19;

FIG. 21A is a top plan view of a strain relief carrier of the presentinvention; FIG. 21B is a side elevational view in cross section of thestrain relief carrier shown in FIG. 21A along lines A-A; FIG. 21C is aside elevational view in cross section of the strain relief carriershown in FIG. 21A along lines B-B; FIG. 21 D is a top plan view of thestrain relief carrier shown in FIG. 21A showing structural foldinglines; and FIG. 21E is a side elevational view in cross section of thestrain relief carrier shown in FIG. 21D along lines A-A which include abracket for receiving the strain relief carrier and differential andcommon mode filter mounted within the strain relief carrier;

FIG. 22A is a side elevational view of a ground strap carrier of thepresent invention; FIG. 22B is a perspective view of the ground strapcarrier including a differential and common mode filter, FIG. 22C is aside elevational view of an alternate embodiment of the ground strapcarrier of the present invention; and FIG. 22D is a perspective view ofthe ground strap carrier shown in FIG. 22C including a differential andcommon mode filter;

FIG. 23 is a side elevational view in cross section of the ground strapcarrier shown in FIGS. 22A-D in operable coupling with an electricmotor;

FIG. 24A is a top plan view of a motor filter carrier of the presentinvention; FIG. 24B is a side elevational view in cross section of themotor filter carrier shown in FIG. 24A; and FIG. 24C is a bottom planview of the motor filter carrier shown in FIGS. 24A and 24B;

FIG. 25A is a bottom plan view of an alternate embodiment of the motorfilter carrier of the present invention; FIG. 25B is a side elevationalview in cross section of the motor filter carrier shown in FIG. 25Aalong lines B-B; FIG. 25C is a top plan view of the motor filter carriershown in FIGS. 25A and 25B; and FIG. 25D is a side elevational view incross section of the motor filter carrier shown in FIG. 25C along linesA-A;

FIG. 26A is a top plan view of an alternate embodiment of the motorfilter carrier of the present invention comprised of multiple layers;FIG. 26B is a side elevational view of the motor filter carrier shown inFIG. 26A; FIG. 26C is a bottom plan view of the motor filter carriershown in FIG. 26A; FIG. 26D is a side elevational view in cross sectionof the motor filter carrier shown in FIG. 26C along lines B-B; FIG. 26Eis a top plan view of an intermediate layer of the motor filter carriershown in FIG. 26A; and FIG. 26F is a side elevational view in crosssection of the motor filter carrier shown in FIG. 26E-along lines C-C;

FIG. 27A is a top plan view of a carrier electrical circuit conditioningassembly of the present invention; and FIG. 27B is a side elevationalview of the carrier electrical circuit conditioning assembly shown inFIG. 27A; and

FIG. 28A is a top plan view of a carrier electrical circuit conditioningassembly applied to a crystal base portion of a crystal component; FIG.28B is a side elevational view of the carrier electrical circuitconditioning assembly applied to a crystal base portion of a crystalcomponent shown in FIG. 28A; FIG. 28C is a front elevational view of thecarrier electrical circuit conditioning assembly enclosed in a crystalcomponent application shown in FIG. 28B with a metal enclosure; and FIG.28D is a side elevational view of the carrier electrical circuitconditioning assembly enclosed in a crystal component application shownin FIG. 28C.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 shows the present invention in its simplest form. Componentcarrier 132 is shown coupled with a differential and common mode filter130 having thru-hole leads 140 for electrical coupling to carrier 132.Differential and common mode filter 130 is disclosed in application Ser.Nos. 08/841,940; 09/008,769; and 09/056,379, incorporated herein byreference. Briefly, the structure of differential and common mode filter130 will be described. Filter 130 consists of a first electrode 136 anda second electrode 138 which are separated by and electrically isolatedfrom a plurality of ground layers 134 and each other. The particulararchitecture creates a line-to-line capacitor and two line-to-groundcapacitors which provide for differential and common mode filtering anddecoupling.

Because filter 130 is a somewhat fragile component, component carrier132 provides a physical support to which filter 130 is electricallycoupled. The first and second electrodes 136 and 138 each haveconductive leads 140 which are inserted into apertures 148 of conductivepads 144. Each conductive pad 144 is electrically isolated from theconductive surface 142 of component carrier 132 by insulating bands 146.Not only does component carrier 132 provide additional physical strengthto differential and common mode filter 130 but it also acts as a groundshield which substantially improves the electrical characteristics offilter 130. When filter 130 is properly coupled to carrier 132 theplurality of ground layers 134 are electrically coupled to one anotherand then coupled to conductive surface 142 by any number of means knownby those of ordinary skill in the art. One common means of electricalcoupling is through the use of solder 150 points connecting portions ofthe ground layers 134 to conductive surface 142. One advantage to therelatively large conductive surface 142 of component carrier 132 is thatif cracks 152 or electrical openings form on conductive surface 142 itsshielding effect is not lost.

A more specific embodiment of the present invention illustrated in FIG.2 is surface mount component carrier 10 for maintaining a ceramic planarsurface mount electrical component, such as a differential and commonmode filter as is disclosed in application Serial Nos. 08/841,940;09/008,769; and 09/056,379, incorporated herein by reference. Carrier 10is a disk comprised of an insulator 14, such as ceramic, having at leasttwo apertures 18. Insulator 14 is covered by a conductive metalizedground surface 16, at least two conductive pads 24 surrounding apertures18, and insulating bands 22 surrounding each conductive pad 24.Throughout the written description “insulator” or “insulating material”may also be referred to as “planar insulator.” Insulating bands 22separate and electrically isolate conductive pads 24 from metalizedground surface 16. In the top plan view of carrier 10, shown in FIG. 3,the preferred embodiment of the invention is circular in shape withsquare insulating bands 22 surrounding partially rounded conductive pads24. Carrier 10 and its various elements can be formed into manydifferent shapes and Applicant does not intend to limit the scope of theinvention to the particular shapes shown in the drawings.

Referring again to FIG. 2, in the preferred embodiment, metalized groundsurface 16 covers a substantial portion of the top and sides of carrier10. Through-hole plating 20 covers the inner walls of aperture 18 andelectrically couples to the corresponding conductive pad 24.Through-hole plating 20 provides greater surface area for electricalcoupling of conductors 34 to conductive pads 24 as the conductors 34 aredisposed through apertures 18. The configuration of metalized groundsurface 16, insulating bands 22 and conductive pads 24 provide thenecessary contacts for connecting a surface mount component, such asdifferential and common mode filter 12, to the upper surface of carrier10, which in turn provides electrical connection between conductors 34and surface mount component 12. The surface mount components referredto, such as differential and common mode filter 12, are provided instandard surface mount packages which include a number of solderterminations for electrically coupling the device to external circuitryor in this case to carrier 10. Filter 12 includes first differentialelectrode band 28 and second differential electrode band 30 extendingfrom either end of filter 12.

Extending from the center of filter 12 is at least one and moretypically two, common ground conductive bands 26. An insulated outercasing 32 electrically isolates first and second differential electrodebands 28 and 30 and common ground conductive bands 26 from one another.A top plan view of a standard surface mount device as just described isshown in FIG. 20 as differential and common mode filter 104. The filter104 is comprised of first differential conductive band 116, seconddifferential conductive band 118 and two common ground conductive bands120. The insulated outer casing 122 separates and electrically isolateseach of the various conductive bands from one another.

FIG. 2 shows filter 12 positioned upon the top surface of carrier 10 sothat the common ground conductive bands 26 come in contact with theportion of the metalized ground surface 16 which separates both of theinsulating bands 22 from one another. This is accomplished bypositioning differential and common mode filter 12 lengthwise betweenthe two conductive pads 24 such that first differential electrode band28 is in contact with one of the two conductive pads 24 and seconddifferential electrode band 30 comes in contact with the otherconductive pad 24. Once filter 12 has been positioned, by default,insulated outer casing 32 of filter 12 aligns with portions ofinsulating bands 22 thereby maintaining electrical isolation between thevarious conductive and electrode bands of filter 12. First and seconddifferential conductive bands 28 and 30 and the common ground conductivebands 26 consist of solder terminations found in typical surface mountdevices. Once filter 12 is positioned upon carrier 10 standard solderreflow methods are employed causing the solder terminations to reflowthereby electrically coupling and physically bonding filter 12 tocarrier 10. Customary solder reflow methods which can be used includeinfrared radiation (IR), vapor phase and hot air ovens or any othermeans which can be used to expose the solder to sufficiently elevatedtemperatures.

Once differential and common mode surface mount filter 12 is coupled tocarrier 10, the combination of the two parts can be manipulated, eithermanually or through various types of automated equipment, withoutsubjecting filter 12 to mechanical and physical stresses normallyassociated with the handling of miniature and delicate electroniccomponents.

Once coupled to carrier 10, filter 12 is electrically connected toexternal circuitry through conductors 34 which may consist of wire leadsor lengths of flexible wire. Once disposed through apertures 18,conductors 34 are soldered to conductive pads 24 and within apertures18. Thru-hole plating 20 allows solder applied to conductive pads 24 andconductors 34 to flow into apertures 18 thereby adhering to thethru-hole plating.

Component carrier 10 reduces mechanical and physical stresses such asshock, vibration and various thermal conditions which filter 12 wouldotherwise be subjected to and provides a complete ground shield forfilter 12. Because carrier 10 has a greater surface area then filter 12and a substantial portion of that surface area is covered by metalizedground surface 16, carrier 10 acts as a ground shield which absorbs anddissipates electromagnetic interference and over voltages. These addedbenefits improve the overall functional performance and characteristicsof filter 12.

FIGS. 4 and 5 illustrate a further alternate embodiment of the presentinvention, that being double-sided carrier 40. Carrier 40 is identicalto carrier 10, as shown in FIG. 2, except that carrier 40 isdouble-sided and as a bottom surface which is substantially identical tothe top surface. This configuration allows two differential and commonmode surface mount filters 12 a and 12 b to be mounted to the upper andlower surfaces of carrier 40. As illustrated in FIG. 4, metalized groundsurface 16 covers substantial portions of the top, sides and bottom ofcarrier 40 providing a greater overall surface area The increasedsurface area of metalized ground surface 16 imparts greater shieldingcharacteristics in carrier 40 which absorb and dissipate electromagneticinterference. In addition, both the top and bottom of carrier 40 includecorresponding conductive pads 24 which are electrically connected to oneanother by thru-hole plating 20 which covers the inner walls ofapertures 18.

Double-sided carrier 40 is also advantageous in that it allows forflexibility needed to meet electromagnetic interference (EMI) and surgeprotection requirements simultaneously through integration of differentsurface mount components on the same carrier substrate. As an example, adifferential and common mode filter. as previously described, could becoupled to the top of carrier 40 while a MOV device could be coupled onthe bottom of carrier 40 effectively placing the filter and MOV devicesin parallel to provide EMI and surge protection in one compact, durablepackage. Because carrier 40 provides a rigid base for maintainingvarious electronic surface mount components, the components themselvesare subjected to less physical stress during manufacturing processeswhich in turn increases yields and lowers manufacturing costs.

FIG. 5 shows a modified configuration of metalized ground surface 16.conductive pads 24 and insulating bands 22. In this alternativeembodiment, insulating bands 22 have been substantially increased suchthat the surface area of carrier 40 is substantially covered byinsulation as opposed to a metalized ground surface. This configurationcan be used when decreased shield characteristics are desired or theparticular interaction between carrier 40 and the surface mountcomponent needs to be precisely controlled.

One example is when parasitic capacitance values must be maintainedbelow a certain level. Note that the particular shapes of insulatingbands 22, shown in FIG. 5, are not necessary. All that is required isthat the surface area covered by metalized ground surface 16 be variedwhich in turn varies the electrical characteristics of double-sidedcarrier 40. It should also be noted that the surface pattern shown inFIG. 3 can be used with the double-sided carrier 40, shown in FIG. 4, orthe surface pattern shown in FIG. 5 could just as easily be used withcarrier 10, shown in FIG. 2. To obtain further of control the electricalcharacteristics of double-sided carrier 40, one surface could beconfigured as shown in FIG. 5 while the other surface, either top orbottom, could be configured as shown in FIG. 3. Altering the upper andlower surface patterns of double-sided carrier 40 depending upon thetypes of surface mount components coupled to carrier 40 allows forobtaining optimal electrical characteristics as needed.

FIGS. 6 through 9 illustrate further alternate embodiments of the singleand double sided carriers benefit to embedding conductive core 38 withininsulator 14 and electrically connecting conductive core 38 to metalizedground surface 16 is that a greater surface area is provided forabsorbing and dissipating electromagnetic interference and over voltageswithout an increase in the overall dimensions of carrier 50.

FIGS. 8 and 9 disclose a further alternate embodiment of the presentinvention in double-sided carrier 60. Carrier 60 is identical to carrier50, shown in FIGS. 6 and 7, except that it is double-sided as theembodiment shown in FIG. 4 with the addition of via 36 disposed throughthe bottom of carrier 60 electrically coupling metalized ground surface16 along the bottom of carrier 60 to conductive core 38. This embodimentprovides a ground having an increased surface area to both surface mountdifferential and common mode filter components 12 a and 12 b coupled tothe top and bottom of double sided carrier 60.

FIGS. 10A and 10B show a further embodiment of the component carriersshown in FIGS. 2-9 configured to accept single and multiple surfacemount components and more specifically surface mount differential andcommon mode filters. As in the numerous embodiments already described,parallel component carrier 160 is a plate or disc comprised ofinsulating material 14, such as ceramic, having at least two apertures18.

Insulating material 14, also commonly referred to as a planar insulator,is covered by conductive ground surface 16, at least two conductive pads24 surrounding apertures 18, and insulating bands 22 surrounding eachconductive pad 24. Insulating bands 22 separate and isolate conductivepads 24 from conductive ground surface 16. The primary differencebetween parallel component carrier 160 and the surface mount componentcarriers previously described is the arrangement of conductive traces156 extending from conductive pads 24. Each conductive pad 24 includestwo conductive traces 156 which extend from one side of conductive pad24 in a generally Y-shaped pattern thereby separating each of theconductive traces 156 from one another. The Y-shaped patterns ofconductive traces 156 are arranged on parallel component carrier 160 sothe distal ends of each conductive trace 156 is aligned with the distalend of an opposing conductive trace 156, each extending from oppositeconductive pads 24. In the parallel component carrier 160 embodimentinsulating bands 22 surround not only conductive pads 24 but alsoextending conductive traces 156 of each conductive pad 24 therebyelectrically isolating conductive pads 24 and their associatedconductive traces 156 from conductive ground surface 16.

Although not required, conductive ground surface 16 is configured tocover as much area upon insulating material 14 as possible in order toprovide for maximum electrical shielding within a predetermined area.Due to the Y-configuration of conductive traces 156, conductive groundsurface 16 in the preferred embodiment encompasses a large rectangularportion between the opposing Y-configurations of conductive traces 156with smaller portions of conductive ground surface 16 extending betweenthe distal ends of opposing conductive traces 156.

FIG. 10B shows parallel component carrier 160 with differential andcommon mode filter 500, as shown in FIG. 10C, coupled thereto. Thesurface mount differential and common mode filter 500 has its firstdifferential electrode bands 28 electrically coupled to the distal endof one conductive trace 156, its second differential electrode bands 30electrically coupled to the distal ends of the opposing conductive trace156 and its common ground conductive bands 26 electrically coupled tothe portion of conductive ground surface 16 which separates the distalends of the opposing conductive traces 156.

The electrical coupling of the various electrodes of differential andcommon mode filter 500 is achieved through means well known in the artincluding but not limited to soldering. In operation, component carrier160 receives electrical conductors (not shown) within apertures 18,which are then electrically coupled to conductive pads 24 throughsoldering or other methods.

The multiple first and second electrode bands 28 and 30 differential andcommon mode filter 500 are separated by common ground electrode bands 26and mounted on parallel component carrier 160. This configurationprovides improved filtering and decoupling performance which results ina further reduction of equivalent series inductance (ESL) and equivalentseries resistance (ESR). The inter-weaving arrangement of the first andsecond electrode bands 28 and 30 and the common ground electrode bands26 optimizes the charge of differential and common mode filter anddecoupler 500.

FIG. 10D shows parallel component carrier 160 with two differential andcommon mode filters 12 coupled thereto. Each surface mount differentialand common mode filter 12 has its first differential electrode band 28electrically coupled to the distal end of one conductive trace 156, itssecond differential electrode band 30 electrically coupled to the distalend of the opposing conductive trace 156 and its common groundconductive bands 26 electrically coupled to the portion of conductiveground surface 16 which separates the distal ends of the opposingconductive traces 156. The electrical coupling of the various bands ofdifferential and common mode filter 12 is achieved through means wellknown in the art including but not limited to soldering. In operation,parallel component carrier 160 receives electrical conductors (notshown) within apertures 18, which are then electrically coupled toconductive pads 24 through soldering or other methods.

The configuration of parallel component carrier 160 provides electricalcoupling between each electrical conductor (not shown) disposed withinapertures 18 and the corresponding first and second differentialelectrode bands 28 and 30 of differential and common mode filter 12thereby providing coupling of the electrical conductors with twodifferential and common mode filters 12 connected in parallel. Theparallel differential and common mode filters 12 provide line-to-lineand line-to-ground filtering to the electrical conductors due to theirinternal architecture which provides for an inherent ground even in theabsence of conductive ground surface 16. Once the common groundconductive bands 26 of each filter 12 are electrically connected toconductive ground surface 16 the inherent ground characteristics offilter 12 increase substantially due to the expanded conductive surfacearea improving the electrical characteristics of both filters 12.Although not shown, it should be understood that parallel componentcarrier 160 can also be configured as a double-sided component carrieras disclosed in FIG. 4 thereby allowing it to accept four differentialand common mode filters 12 as opposed to only two as shown in FIG. 1 OD.It should also be understood that the invention is not limited to eithertwo or four differential and common mode filters 12. Multiple filters 12could be arranged on either side of parallel component carrier 160 in anarrangement similar to that described with the only limitation being thephysical space available which is dictated by the size of parallelcomponent carrier 160. It should also be understood that any of thevariations of parallel component carrier 160 can also include aconductive core coupled through vias to conductive ground surface 16similar to the arrangement shown in FIG. 8 and described previously.Such an arrangement, including an inner conductive core, provides evengreater surface area to the conductive ground surface further increasingthe electrical shielding and the overall performance characteristics ofthe differential and common mode filters 12 coupled to parallelcomponent carrier 160.

FIGS. 11-14 illustrate further alternate embodiments of the componentcarriers of the present invention which receive a plurality ofdifferential and common mode filters 12 for use in connector andprototype assemblies. Referring to FIG. 11 A, multi-chip componentcarrier 170 is shown which is configured for use in electricalconnectors such as D-sub connectors. As in previous embodiments of thepresent invention, multi-chip component carrier 170 is built uponinsulating material 172. Most of the surface area of component carrier170 consists of insulating material 172. FIGS. 11B and 11C, whichdisclose cross-sections of component carrier 170, show that ground layer174 is embedded within insulating material 172 and spans the majority ofthe area of component carrier 170. Ground layer 174 is conductive andtypically consists of a metallic material, although any type ofconductive matter could be substituted. In addition to ground layer 174being embedded within component carrier 170, the peripheral edges ofcomponent carrier 170 also include conductive surfaces 176 which areelectrically coupled to ground layer 174. The internal ground layer 174of component carrier 170 is also electrically connected to a pluralityof vias 182 which extend to conductive pads 180 formed on the surface ofcomponent carrier 170. As is well known in the art, vias 182 includeconductive plating which electrically connects conductive pads 180 toground layer 174, which in turn is electrically coupled to peripheralconductive surface 176. Also disposed in component carrier 170 are aplurality of feed-thru apertures 178 which are electrically isolatedfrom internal ground layer 174 by insulation 188. Formed around thevarious feed-thru apertures 178 are first and second electrode pads 184and 186. Each first electrode pad 184 is formed in a predeterminedposition in relation to a corresponding second electrode pad 186 whereinthe combination of first and second electrode pads 184 and 186 include avia 182 positioned there between.

As shown in FIG. 11A, the plurality of differential and common modefilters 12 are positioned between the first and second electrode pads184 and 186 in a lengthwise orientation such that first differentialelectrode band 28 comes in contact with first electrode pad 184 and asecond differential electrode band 30 comes in contact with secondelectrode pad 186. Vias 182 are positioned between first and secondelectrode pads 184 and 186 so that conductive pads 180 of vias 182 comein contact with common ground conductive bands 26 of the differentialand common mode filters 12. The various conductive bands of each filter12 are physically and electrically coupled to their respectiveconductive pads through soldering or other well known means. Inoperation, multi-chip component carrier 170 is placed over and receiveswithin its plurality of feedthru apertures 178 male pins (not shown)associated with standard D-sub connector assemblies. The plurality ofpins are then electrically coupled to the plurality of first and secondelectrode pads 184 and 186 through standard means. In alternateembodiments feed-thru apertures 178 are plated with a conductive surfaceelectrically connected to its associated first or second electrode pad184 and 186 such that when the D-sub connector assembly pins (not shown)are inserted within feed-thru apertures 178 the physical contact betweenthe pins and the conductive surfaces provides the necessary electricalcoupling.

FIG. 12 shows a further embodiment of the present invention consistingof a differential and common mode strip filter carrier 200. Differentialand common mode strip filter 202 is disclosed in commonly owned,application Ser. Nos. 08/841,940; 09/008,769; and 09/056,379,incorporated herein by reference. As in previous embodiments, stripfilter carrier 200 is constructed upon a plate or block of insulatingmaterial 216 and includes a plurality of feed-thru apertures 204 whichreceive male pins (not shown) from a connector assembly such as an RJ-45connector. Referring to FIG. 12A, the top surface of carrier 200includes conductive surface 210 running along the four edges of the topsurface with portions of conductive surface 210 extending inward in apredetermined pattern. Conductive surface 210 is electrically coupled toperipheral conductive surface 208 which surrounds the four sides ofcarrier 200, which is then electrically coupled to conductive surface206. Conductive surface 206 covers the majority of the area of thebottom surface of strip filter carrier 200 as shown in FIG. 12B.

Each feed through aperture 204, as shown in FIG. 12A, includes aconductive track extending from aperture 204 towards the center of stripfilter carrier 200 in a predetermined pattern. A portion of differentialand common mode strip filter 202 is shown positioned upon the topsurface of carrier 200 to demonstrate its coupling to strip filtercarrier 200. Common ground conductive band 218 of filter 202 comes incontact with conductive surface 210 that runs along the longitudinalends of strip filter carrier 200. The predetermined positioning of thefirst and second differential electrode bands 220 and 222 of filter 202align with their corresponding conductive tracks 226 and the commonground conductive bands 218 align with the inward extending conductivesurfaces 210. As described in the previous embodiments, the conductivebands are electrically connected to their corresponding conductivetracks and conductive surfaces through means including but not limitedto soldering. As shown in FIG. 12B, feed-thru apertures 204 aresurrounded by conductive bands 214 which, in turn, are then electricallyisolated from conductive surface 206 by insulation bands 212. As shownin FIG. 12C, a substantial area of conductive surface 206 iselectrically coupled through peripheral conductive surfaces 208 toconductive surface 210, which in turn is electrically coupled to commonground conductive band 218 of strip filter 202. This arrangementprovides for the increased shielding and improved electricalcharacteristics of differential and common mode strip filter 202previously described in relation to alternate embodiments of the presentinvention.

In use carrier 200 is placed over and receives within feed-thruapertures 204 a plurality of male pins (not shown) from a connectorassembly. Feed-thru apertures 204 include a conductive surface platingso that each conductive track 226 is electrically coupled to itscorresponding conductive band 214. Either through soldering or aconductive resistive fit, each male pin (not shown) is electricallycoupled to its corresponding first or second differential electrode band220 and 222 of differential and common mode strip filter 202.

FIGS. 13A-13C show a further alternate embodiment of the presentinvention.

FIGS. 13A and 13B disclose differential and common mode strip filtercarrier 230 having most of the top and bottom surface area composed ofinsulating material 216 with only a small border of conductive surface210 surrounding the outer edges of both the top and bottom surface ofstrip filter carrier 230. Conductive surface 210 also surrounds thesides of strip filter carrier 230 and electrically couples to theconductive surface 210 running along the edges of both the top andbottom surfaces. Referring to FIG. 12A, conductive surface 210 alsoincludes portions which extend inward toward the center of the topsurface of strip filter carrier 230 in a predetermined pattern. Althoughnot shown, strip filter carrier 230 is configured to receivedifferential and common mode strip filter 202 as shown in FIG. 12A.

One difference in strip filter carrier 230 from component carrier 200 asdisclosed in FIGS. 12A-12C is that ground layer 234 is now embeddedwithin insulating material 216 and electrically coupled to conductivesurfaces 210, which run along the sides of strip filter carrier 230, andthrough vias 232. Ground layer 234 is also electrically coupled toconductive surface 210 through vias 232 disposed within the inwardlyextending portions of conductive surface 210 on the top surface of stripfilter carrier 230. Again, strip filter carrier 230 includes feed-thruapertures 204 having a conductive surface plating which electricallycouples conductive tracks 226 on the top surface of strip filter carrier230 to conductive bands 214 on the bottom surface of strip filtercarrier 230. Male pins (not shown) from a connector assembly arereceived within feed-thru apertures 204 allowing for electrical couplingto the various first and second differential electrode bands ofdifferential and common mode strip filter 202 (not shown). As shown inFIG. 13C, each feed-thru aperture 204 is surrounded by insulation 224electrically isolating the male pins inserted through apertures 204 fromthe internal ground layer 234 of strip filter carrier 230. FIGS. 11-13demonstrate that a variety of component carrier configurations arecontemplated by applicant which include embodiments for receivingdifferent component packages for differential and common mode filters.In addition, various configurations of the conductive surface or groundlayer are envisioned which provide for additional electrical shieldingand substantially improve the electrical characteristics and performanceof the differential and common mode filters attached to the carriers.

FIGS. 14A-14D illustrate a multi-component differential and common modefilter prototype carrier 240 which allows use of a plurality ofdifferential and common mode filters 12 in combination with the benefitsprovided by the component carriers as described herein. At the same timeprototype carrier 240 allows for additional circuitry to be coupled tocarrier 240 and filters 12 in a convenient and flexible manner allowingengineers to easily incorporate the technology described into a vastarray of electronic products. Prototype carrier 240 is constructed in asimilar manner to that of the many previously described embodiments.Prototype carrier 240 consists of a plate of insulating material 242having predetermined configurations of conductive surface 244 along itstop and bottom surfaces and electrically interconnected by peripheralconductive surface 246 which surrounds the sides of prototype carrier240. Positioned upon both the top and bottom surfaces of prototypecarrier 240 are a plurality of smaller conductive surfaces 250 which inturn are surrounded by insulating material 242 electrically isolatingconductive surfaces 250 from conductive surfaces 244.

As shown in FIG. 14A, differential and common mode filter 12 ispositioned lengthwise between two corresponding conductive surfaces 250such that first differential electrode band 28 comes into physicalcontact with one conductive surface 250, second differential electrodeband 30 comes in contact with a second and corresponding conductivesurface 250 and common ground conductive bands 26 come in physicalcontact with conductive surface 244 which separates the twocorresponding conductive surfaces 250. As in previous embodiments, thevarious bands of filter 12 are electrically coupled to their respectiveconductive surfaces through soldering and other common means. To providethe versatility required to interconnect additional electroniccomponents to prototype carrier 240 and differential and common modefilter 12, a plurality of apertures 248 are disposed within conductivesurfaces 250 and insulating material 242. To use prototype carrier 240various external electrical components or wires are disposed withinapertures 248 and then permanently connected through soldering or othermeans. Prototype carrier 240 is essentially a “bread board” whichelectrical engineers use to configure test circuits. Although not shown,it should be understood and applicant contemplates that the prototypecarrier 240 disclosed in FIGS. 14A-14D could be configured with aninternal ground layer electrically coupled to conductive surfaces 244through vias as disclosed previously in FIGS. 11 and 13. Thisarrangement would provide for greater effective surface area withincreased shielding effects.

Illustrated in FIGS. 15 through 18 is a further alternate embodiment ofthe component carriers of the present invention used to receive andmaintain a multiconductor thru-hole filter within a multi-conductorconnector shell. Connector carrier 70, shown in FIGS. 15 and 16, iscomprised of wall 78 formed in the shape of a parallelogram or D-shapehaving a shelf 76 extending inward from wall 78 along the bottom of allfour sides. Wall 78 includes a plurality of outwardly extendingprotuberances 72 which act as spring or resistive fit contacts forcarrier 70 as will be further described. FIG. 17 shows a standard D-subconnector shell 74 which includes outwardly extending front wall 88shaped in the form of a parallelogram or D-shape. Shell 74 has a shelf86 extending inwardly from the bottom of wall 88 which acts as a stopand a mounting shelf for carrier 70.

FIG. 18 shows an exploded prospective view of D-sub connector shell 74,connecter carrier 70 and multi-conductor differential and common modefilter 80. While carrier 70 can be used with a variety of filters,Applicant contemplates multi-conductor filter 80 being a differentialand common mode multi-conductor filter as disclosed in application Ser.Nos. 08/841,940; 09/008,769; and 09/056,379, previously incorporatedherein by reference. Filter 80 includes a plurality of apertures 84which receive contact pins (not shown) associated with male D-subconnectors commonly known in the art.

One example of such a connector is a male D-sub RS-232 communicationsconnector found in personal computers for coupling external devices suchas modems to the computers. To be used in this embodiment of carrier 70,filter 80 must also be formed in the shape of a parallelogram or D-shapeand have dimensions similar to those of carrier 70. Filter 80 includesplated surface 82 along its periphery which is electrically connected tothe common ground conductive plates of filter 80. In use, conductorcarrier 70 receives multi-conductor filter 80 which abuts against innershelf 76. Shelf 76 is coated with a solder reflow or an equivalentconductive surface so that once filter 80 is inserted into carrier 70and resting upon shelf 76, standard reflow methods can be used to solderfilter 80 within carrier 70. Such standard reflow methods include theuse of infrared radiation (IR), vapor phase and hot air ovens. Thesubassembly of filter 80 and carrier 70 is then inserted within D-subconnector shelf 74 so the subassembly is contained within wall 88 andabutted against shelf 86 which serves as a stop for carrier 70.Connector carrier 70 is fabricated from a conductive material such asmetal and, to obtain the full benefits of the present invention, D-subconnector shell 74 will also be fabricated from a conductive metallicmaterial. The plurality of protuberances 72 provide a resistive fit forcarrier 70 against wall 88 of D-sub connector shelf 74 which maintainscarrier 70 within shell 74 and provides for electrical conductionbetween plated surface 82 of filter 80 and shell 74. As in previousembodiments, electrically coupling the ground connection formulti-conductor filter 80 to carrier 70 and D-sub connector shell 74increases the surface area provided for absorbing and dissipatingelectromagnetic interference and over voltages.

An additional embodiment of the present invention, connector carrier100, is illustrated in FIG. 19. In this embodiment the surface mountcomponent carrier is directly incorporated within an electronicconnector. Connector carrier 100 is comprised of a metalized plasticbase 112 having a plurality of apertures 98 disposed through base 112,each of which receives a connector pin 102. Although not shown, portionsof each connector pin 102 extends through base 112 and out of the front110 of connector carrier 100. The portions of pins 102 extending fromthe front 110 of carrier 100 form a male connector which is then, inturn, received by a female connector as is known in the art.

The same configuration could be implemented on a female connector whichthen receives male pins. Coupled to both edges of connector carrier 100,although only one edge is shown, is mounting base 114 which elevatesbase 112 from a surface such as a printed circuit board. The particularembodiment of connector 100 shown in FIG. 19 is of a right angleconnector in which the tips of pins 102 would be inserted withinapertures in a printed circuit board. Pins 102 would then be soldered tothe individual apertures or pads in the printed circuit board to provideelectrical connection between pins 102 and any circuitry on the printedcircuit board. To provide for the coupling of a plurality ofdifferential and common mode filters 104 between the various connectorpins 102, two insulating bands 106 and 107 are provided to electricallyisolate each of the connector pins 102 from the metalized plastic base112 which covers substantially all of the surface area of connectorcarrier 100.

Referring to FIG. 20, the relationship between insulating bands 106 and107, metalized plastic base 112 and differential and common mode filter104 will be explained in more detail. While only one example is shown,both insulating bands 106 and 107 include a plurality of conductive pads108 which surround apertures 98. Conductive pads 108 are electricallycoupled to connector pins 102 disposed through apertures 98.

Insulating bands 106 and 107 provide a non-conductive barrier betweenthe conductive pads 108 and the metalized plastic base 112. Surfacemount components, such as differential and common mode filter 104, arepositioned between insulated bands 106 and 107 so that firstdifferential conductive band 116 of filter 104 comes in contact with aportion of a conductive pad 108 and second differential conductive band118 comes in contact with a portion of an opposite conductive pad 108.Insulated outer casing 122 of filter 104 slightly overlaps onto eachinsulating band 106 and 107 and metalized plastic base 112 to maintainelectrical isolation of first and second differential conductive bands116 and 118 and metalized plastic base 112 of connector carrier 100.Because metalized plastic base 112 runs between insulating bands 106 and107, common ground conductive bands 120 of filter 104 come in contactwith the metalized plastic base 112. As described earlier, each of thevarious conductive bands of filter 104 are comprised of solderterminations which, when subjected to known solder reflow methods,physically and electrically couple to any metallic surfaces which theycome in contact thereby permanently coupling the surface mountcomponents, i.e. filter 104, to connector carrier 100. As in theprevious embodiments, connector carrier 100 allows miniature, fragilesurface mount components to be used without subjecting those componentsto increased physical stress which can cause damage to the components,lowering production yields and increasing overall production costs.Metalized plastic base 112 also provides a large conductive surface areaconnected to the ground terminations of filter 104 improving the groundshield used to absorb and dissipate electromagnetic interference andover voltages.

As described herein with relation to each of the differential and commonmode filter carrier embodiments, the primary advantages are theadditional physical strength the filter carriers provide to thedifferential and common mode filters and the increased shield and groundeffects provided by the enlarged conductive surface areas coupled to thedifferential and common mode filters. FIGS. 21A-21E show strain reliefcarrier 260 which provides these benefits to differential and commonmode filters configured with wire leads 266 as opposed to the varioussurface mount embodiments. Strain relief carrier 260 is comprised of aconductive material such a metal which is fabricated to create carrierframe 264. With reference to FIGS. 21B and 21C, strain relief carrier260 includes a horizontal component ledge 274 extending inward fromvertical wall 272 which completely surrounds and receives differentialand common mode filter 262. Extending from the upper end of verticalwall 272 is member 270 which extends outward to bend 276 with theremainder 278 of member 270 then directed back toward filter 262. In thepreferred embodiment, disclosed in FIG. 21D, strain relief carrier 260is formed of a single conductive material in which extended members 270,vertical walls 272 and component ledge 274 are formed throughpredetermined bends along the dashed lines. The overall metal carrierframe 264 provides differential and common mode filter 262 with theadditional physical strength and support that prevents filter 262 frombeing damaged in use. In addition, because strain relief carrier 260 isformed of a conductive material it carrier 290 is formed from a singlepiece of conductive material into two inverted and opposing U-shapes.

Differential and common mode filter 12 is received and maintained uponbase 292 and between inner protuberance 294 and outer protuberance 296which provide a tight, resistive fitting for filter 12. The resistivefitting also forces electrical contact between base 292 and commonground conductive bands 26 of filter 12 as shown in FIG. 22B. Referringto FIG. 23, ground strap carrier 290 and differential and common modefilter 12 are coupled to electric motor housing 304 by hook 308. Hook308 is comprised of vertical member 298, top 300 and vertical member 302as shown in FIGS. 22A and 22B. Because ground strap carrier 290 isformed of a conductive material, when it is coupled to an electricalmotor, the conductive motor housing 304 provides an enhanced shieldingand ground surface area for differential and common mode filter 12 whichenhances its shielding and electrical characteristics. Referring to FIG.23, the first and second differential electrode bands 28 and 30 ofdifferential and common mode filter 12 are electrically connected to themotor through spring retention conductors 306 formed within the motorand weaved around motor components 310. FIGS. 22C and 22D disclose analternate embodiment of ground strap carrier 290 in which base 292 iselongated such that filter 12 can be accepted within carrier 290 in aflat orientation. The flat orientation allows both common groundconductive bands 26 of filter 12 to come in contact with protuberances294 and 296. Ground strap carrier 290 provides a means for couplingsurface mount differential and common mode filters within electricmotors despite the small size and fragile nature of surface mountdifferential and common mode filters.

FIGS. 24A-24C show a further embodiment of the present invention asmotor filter carrier 320. As in previous embodiments, motor filtercarrier 320 is constructed on a base of insulating material 326, asshown in FIG. 24B, which can be formed into any shape but in thepreferred embodiment is circular to match the shape of most electricmotors. Motor filter carrier 320 includes conductive surface 328 whichcovers most of the top and bottom surfaces of motor filter carrier 320.Electrically coupling the top and bottom conductive surfaces 328 isperipheral conductive surface 330 which surrounds the sides of motorfilter carrier 320 to substantially cover the outer surfaces of motorfilter carrier 320 with a conductive ground surface. Disposed throughthe center of motor filter carrier 320 is aperture 322 which receives arotor (not shown) of an electric motor.

Surrounding aperture 322 is insulation 332 which prevents electricalconnection between motor filter carrier 320 and the rotor of theelectric motor. Motor filter carrier 320 also includes a plurality ofmounting apertures 344 which receive mounting hardware, such as screws,used to physically connect motor filter carrier 320 onto an electricmotor.

Referring to FIG. 24A, motor filter carrier 320 includes threeconductive apertures 342 which receive corresponding pins 316 fromelectrical connector 334. Attached and electrically coupled to each pad342 is a conductive track 340 which extends from pad 342 towards thecenter of motor filter carrier 320. The three conductive tracks 340 arearranged in parallel to receive surface mount differential and commonmode filter 12A.

The two outer conductive tracks 340 have insulating material 326surrounding the conductive track 340 in order to isolate the first andsecond differential electrode bands 28 and 30 of filter 12A fromeverything except their associated conductive tracks 340. The centerconductive track 340 is electrically coupled to conductive surface 328of motor filter carrier 320 which, in turn, electrically couples commonground conductive bands 26 of filter 12A to conductive surface 328 ofmotor filter carrier 320. Through this arrangement surface mountdifferential and common mode filter 12A is physically mounted to the topsurface of motor filter carrier 320 with each of its bands electricallyconnected to each of the conductors 316 of electrical connector 334. Thecenter pin 316 of electrical connector 334 is electrically coupled tothe top and bottom surfaces by feedthru aperture 338 which is platedwith a conductive surface or through a direct connection using a metallead (not shown).

Referring to FIG. 24C, the bottom surface of motor filter carrier 320includes a similar arrangement of conductive tracks 340 and conductivepads 342 which receive a second surface mount differential and commonmode filter 12B. Differential and common mode filters 12A and 12B areelectrically connected in parallel by a plurality of feed-thru apertures338 shown in FIG. 24B or by connector pins directly. Each of theconnector pins 316 of electrical connector 334 are disposed withinfeed-thru apertures 338 and electrically connected to a conductive pad342 on both the top and bottom surfaces of motor filter carrier 320. Thedescribed arrangement allows parallel coupling of surface mountdifferential and common mode filters 12A and 12B which allows both lowand high frequency filters to be combined in parallel to electricallycondition an electrical motor coupled to motor filter carrier 320. Thebottom surface of motor filter carrier 320, shown in FIG. 24C, differsfrom the top surface in that it includes an enlarged portion ofinsulating material 326 which electrically isolates two of the threeelectrical motor brushes 324 from conductive surface 328. The embodimentof the present invention disclosed in FIGS. 24A-24C is configured foruse with a three brush electric motor with motor filter carrier 320replacing a conventional cover of an electric motor. The three brushes324 come in contact with the bottom surface of motor filter carrier 320when carrier 320 is coupled to an electrical motor (not shown). As thethree bushes 324 are the portions of the electric motor to receive thedifferential and common mode filter, the bottom surface of motor filtercarrier 320 provides electrical coupling to surface mount differentialand common mode filters 12A and 12B. One of three brushes 324 iselectrically coupled to conductive surface 328 by flexible wire braid356 connected to feed-thru brush aperture 318 and the nearest associatedelectrical motor brush 324. To electrically connect the remaining twobrushes 324 to the first and second differential electrode bands 28 and30 of filters 12A and 12B, brush contacts 354 comprised of conductivetracks extending from conductive tracks 340 come into physical contactwith their respective brushes 324.

Motor filter carrier 320 when coupled with one or more differential andcommon mode filters 12A and/or 12B prevents electric fields generatedwithin the motor, both low and high frequency, from coupling to wires,leads or traces which act as an antennas dispersing electrical noisethroughout an electrical system. The present invention replaces knowntechnology which required multiple capacitors, inductors and relatedcircuits in addition to a shield or a protective shell enclosing themotor. Motor filter carrier 320 is particularly advantageous becausemany smaller electric motors have a plastic or nonmetallic top whichallows electrical noise generated within the motor housing to escape orbe transmitted out of the motor where it can interfere with otherelectrical systems. When motor filter carrier 320, in conjunction withone or more differential and common mode filters 12, is connected to aconductive enclosure of an electric motor the combination preventsinternally generated electrical noise from escaping. The strayelectrical noise is then disposed of by shunting the noise to theconductive motor housing ground connection. The present inventionprovides a low cost, simple assembly which requires less volume andprovides for high temperature EMI performance in one package.

FIGS. 25A-25D show a further alternate embodiment of the presentinvention as motor filter carrier 350. The primary differences of thepresent embodiment to that disclosed in FIG. 24 is that the top andbottom surfaces of motor filter carrier 350 are comprised of insulatingmaterial 326 as opposed to a conductive surface. The top surface ofmotor filter carrier 350, shown in FIG. 25C, is essentially identical tothe top surface described with respect to FIG. 24A except that most ofthe top surface is comprised of insulating material 326. The bottomsurface of motor filter carrier 350, shown in FIG. 25A, is alsosubstantially similar to the bottom surface described with respect toFIG. 24C except that most of the bottom surface is comprised ofinsulating material 326. There are also several other differences whichwill now be described. Referring to FIG. 25A, the bottom surfaceincludes two conductive tracks 340 which are electrically coupled toconductors 316 of electrical connector 334. Electrically coupling eachconductive track 340 to its respective electric motor brush 324 areflexible wire braids 348. In order to achieve the improved shielding andground benefits, motor filter carrier 350 includes conductive core 346spanning the circular area of motor filter carrier 350 while beingembedded within top and bottom layers of insulating material 326.Referring to FIG. 25B, each of the plurality of mounting apertures 344include conductive surfaces 352 which are electrically coupled toconductive core 346. When motor filter carrier 350 is placed over oneend of an electric motor (not shown) with the rotor being disposedwithin aperture 322, the electrical coupling of the conductive housingof the electric motor with conductive core 346 of motor filter carrier350 is achieved through the use of conductive mounting hardware such asmetal screws. The conductive hardware is used to complete an electriccircuit or loop between the motor housing mounting apertures 344 andconductive core 346. It can be seen from FIG. 25D that middle conductivepin 316 of connector 334 only extends within motor filter carrier 350until it comes in contact with conductive core 346 providing electricalcoupling between conductive core 346 and common ground conductive bands26 of surface mount differential and common mode filter 12. Shown inFIG. 25B, the remaining conductive pins 316 attached to electricalconnector 334 extend through the entire width of motor filter carrier350 to electrically couple first and second differential electrode bands28 and 30 to their respective electrical motor brushes 324 usingflexible wire braids 348. Although this particular embodiment does notdisclose the use of a second surface mount differential and common modefilter connected to the bottom of motor filter carrier 350, such analternate embodiment is contemplated by applicant. For the same reasonsapplicant also contemplates motor filter carrier 320 shown in FIGS.24A-24C only having a single differential and common mode filter.

A third alternate embodiment of the motor filter carriers of the presentinvention is disclosed in FIGS. 26A-26F as motor filter carrier 370.This embodiment provides the added benefit of having surface mountdifferential and common mode filter 12 embedded within motor filtercarrier 370 thus providing a single component for use in providingdifferential and common mode filtering and ground shielding to electricmotors. As in previous embodiments, motor filter carrier 370 includes anelectrical connector 334 coupled to the top surface of motor filtercarrier 370 with the top surface covered by conductive surface 328.Motor filter carrier 370 also includes a plurality of mounting apertures344 and aperture 322 disposed through motor filter carrier 370. Aperture322 is electrically isolated from conductive surface 328 by insulation322. The bottom surface of motor filter carrier 370, as shown in FIG.26C, is also covered by conductive surface 328 which is electricallyconnected to conductive surface 328 on the top of motor filter carrier370 by peripheral conductive surface 330 surrounding the sides of motorfilter carrier 370. As in the previous embodiments, electric motorbrushes 324 come in connect with the bottom surface of motor filtercarrier 370 and are electrically coupled to surface mount differentialand common mode filter 12 by flexible wire braids 348. The centraldifference of the present embodiment is the inclusion of internal layer360 to which surface mount differential and common mode filter 12 isphysically coupled. Internal layer 360 is comprised of insulatingmaterial 326 and includes a plurality of conductive tracks deposited onthe surface of internal layer 360 used to electrically couple thevarious bands of differential and common mode filter 12 to electricmotor brushes 324. Referred to FIG. 26E, internal layer 360 includesfirst conductive track 372, second conductive track 374 and groundconductive track 376. Each conductive track is electrically coupled toone of the conductive pins 316 extending from electrical connector 334.Surface mount differential and common mode filter 12 is placed on top ofinternal layer 360 in a predetermined position such that conductivetrack 372 is electrically coupled to second differential electrode band30 and conductive track 374 is electrically connected to firstdifferential electrode band 28. Conductive track 376 comes in contactwith and is electrically coupled to common ground conductive bands 26 offilter 12. Each of the conductive tracks, 372,374 and 376, come incontact with and surround one or more feed-thru apertures 338 whichprovide electrical coupling to the plurality of brushes 324.

Each of the feed-thru apertures 338 are covered with a conductivesurface so flexible wire braid 348 connects brushes 324 to filter 12when soldered within feed-thru apertures 338.

Although not shown, the present embodiment could be combined with theprevious motor filter carrier embodiments in any number of combinationsincluding having surface mount differential and common mode filterscoupled to an internal layer and both top and bottom surfaces therebyproviding even more versatility and filtering capability FIGS. 27A and27B show the carrier electrical circuit conditioning assembly 400 whichresulted from the combination of the previously described componentcarriers with the differential and common mode filter 12. Shown in FIG.27A, differential and common mode filter 12 is placed upon conductiveground surface 402 making physical contact between conductive groundsurface 402 and common ground conductive electrode bands 26. First andsecond differential conductive bands 30 and 28 are placed uponinsulation pads 408 with differential signal conductors 404 and 406disposed through each insulation pad 408. First differential electrodeband 28 and first differential signal conductor 404 are then furthercoupled physically and electrically to each other through a well knownmeans in the art such as solder 410. In addition, second differentialelectrode band 30 and second differential signal conductor 406 arecoupled physically and electrically to one another and common groundconductive electrode bands 26 are coupled physically and electrically toground area 402.

The internal construction of differential and common mode filter 12electrically isolates differential signal conductor 404 and firstdifferential electrode band 28 from second differential signal conductor406 and second differential electrode band 30. The internal constructionof the differential and common mode filter 12 creates a capacitiveelement coupled between the first and second differential signalconductors 404 and 406 and creates two capacitive elements, one coupledbetween the first differential signal conductor 404 and the commonconductive ground surface 402 and the other coupled between the othersecond differential signal conductor 406 and the common conductiveground surface 402. While this arrangement of line-to-line andline-to-ground filtering is occurring the first and second differentialsignal conductors 404 and 406 remain electrically isolated from oneanother.

From FIG. 27B it can be seen that first and second differentialelectrode bands 28 and 30 are prevented from coming into direct physicalcontact with conductive ground surface 402 due to insulating pads 408interposed between differential signal conductors 404 and 406 and theconductive ground surface 402.

The combination of the differential and common mode filter 12 with itscapacitive elements coupled line-to-line between differential signalconductors 404 and 406 and line-to ground between the differentialsignal conductors 404 and 406 and conductive ground surface 402 providessubstantial attenuation and filtering of differential and common modeelectrical noise. At the same time the combination also performssimultaneous differential line decoupling. Another benefit provided bythe combination include mutual cancellation of magnetic fields generatedbetween differential signal conductors 404 and 406. By connecting thecommon ground conductive electrode bands 26 to a large conductive groundsurface 402, increased shielding of the ground plane is provided todifferential and common mode filter 12 which further enhances thedesired functional characteristics of differential and common modefilter 12.

The combination of the differential and common mode filter 12 with theinternal partial Faraday-like shields electrically connected toconductive ground surface 402 cause noise and coupling currents fromdifferent elements of carrier electrical circuit conditioning assembly400 to be contained at their source or to conductive ground surface 402without affecting differential signal conductors 404 and 406 or otherelements of carrier electrical circuit conditioning assembly 400 whendifferential and common mode filter 12 is attached between differentialsignal conductors 404 and 406. Carrier electrical circuit conditioningassembly 400 reduces, and in some cases eliminates, forms of capacitorparasitics and stray capacitance between differential signal conductors404 and 406. Differential and common mode filter 12 provides thesebenefits due to its internal, partial Faraday-like shields that almostenvelope the internal differential electrodes of differential and commonmode filter 12 which connect to ground conductive electrode bands 26.These benefits are significantly increased when the partial Faraday-likeshields are electrically connected by ground conductive electrode bands26 to conductive ground surface 402.

FIGS. 28A-28D show one application of carrier electrical circuitconditioning assembly 400 used in conjunction with a crystal. Referringto FIG. 28B, differential and common mode filter 12 is physically andelectrically coupled between first and second differential signalconductors 404 and 406 and to ground conductive surface 402. In thisparticular application ground conductive surface 402 is comprised of themetal base of the crystal, which in turn is connected to a metal cover415 shown in FIGS. 28C and 28D. First and second differential signalconductors 404 and 406 of carrier electrical circuit conditioningassembly 400 are electrically isolated from ground conductive surface402 by insulation pads 408. Common ground conductive electrode bands 26are electrically connected to ground conductive surface 402 using solder410 or other similar means. A ground conductor pin 414 is also attachedor molded monolithically to conductive ground surface 402 by soldering,welding or casting. Ground conductor pin 414 allows for furtherconnection of crystal component application 416 to a system ground (notshown). The internal construction of the differential and common modefilter 12 creates a capacitive element coupled between the first andsecond differential signal conductors 404 and 406 and creates twocapacitive elements, one coupled between the first differential signalconductor 404 and ground conductive surface 402 and the other coupledbetween the other second differential signal conductor 406 and groundconductive surface 402. While this arrangement of line-to-line andline-to-ground filtering is occurring the first and second differentialsignal conductors 404 and 406 remain electrically isolated from oneanother. From FIG. 28B it can be seen that first and second differentialelectrode bands 28 and 30 are prevented from coming into direct physicalcontact with ground conductive surface 402 due to insulating pads 408interposed between differential signal conductors 404 and 406 and theground conductive surface 402.

FIGS. 28C and 28D show the final combination of crystal componentassembly 416 and its metal housing 415 which provides an additionalground shield for the combination.

The carrier electrical circuit conditioning assembly 400 shown incrystal component assembly 416 simultaneously filters and attenuatescommon mode and differential mode electrical noise attributed to suchcircuitry including such noise found between differential electricalline conductors 404 and 406. Crystal component assembly 416 can alsosubstantially reduce and in some cases eliminate or prevent differentialcurrent flow, mutual inductive coupling such as cross talk and groundbounce between either differential electrical line conductor 404 and406. The carrier electrical circuit conditioning assembly 400 alsosimultaneously provides mutual cancellation of opposing magnetic fieldsattributed to and existing between differential electrical lineconductors 404 and 406. In addition, carrier electrical circuitconditioning assembly 400 complements the inherent, internal groundstructure and internal shield structures that nearly envelope orsurround each opposing electrode within differential and common modefilter 12 to substantially improve overall noise attenuation ondifferential signal conductors 404 and 406 that would otherwise affectand degrade the desired performance of crystal component application416. The essential elements of carrier electrical circuit conditioningassembly 400 consist of differential and common mode filter anddecoupler 12 as defined herein with a capacitive element coupled betweenthe first and second differential signal conductors 404 and 406 and twocapacitive elements, one coupled between the first differential signalconductor 404 and ground conductive surface 402 and the other coupledbetween the other second differential signal conductor 406 and groundconductive surface 402 while maintaining electrical isolation betweenthe first and second differential signal conductors 404 and 406; atleast two energized differential electrical line conductors; and aphysical and electrical coupling of common ground conductive electrodebands 26 of differential and common mode filter 12 to ground conductivesurface 402. The various elements listed that make up carrier electricalcircuit conditioning assembly 400 are interconnected using solder 410,conductive epoxy 417 or other means well known in the art.

Although the principles, preferred embodiments and preferred operationof the present invention have been described in detail herein, this isnot to be construed as being limited to the particular illustrativeforms disclosed. They will thus become apparent to those skilled in theart that various modifications of the preferred embodiments herein canbe made without departing from the spirit or scope of the invention asdefined by the appended claims. The numerals in claims 1-18 presentedbelow refer to the elements in figures in United States patentapplication publication 20030048029, which is incorporated herein byreference. Claims 1-18 are copied from United States patent applicationpublication 20030048029 herein for purposes of interference.

1. A method for accessing information on a plurality of differentdevices in a network, comprising: receiving a request from a providerfor device property information of a first device; calling a method of afactory class in response to the request, wherein the factory classmanages a device program for each of the different devices;instantiating, by the called factory class method, a first deviceprogram for the first device, wherein the first device program includesdevice program methods that are common in each of the device programsfor the different devices; calling, by the first device program, methodsin a page program to access the device property information, wherein themethods in the page program include device specific commands to querythe first device for the device property information; executingstatements in the first device program to query the first device for thefirst device property information; and updating a first page in acomputer-readable medium with the first device property information inresponse to the query, wherein the computer-readable medium includes aset of pages that each include device property information for each ofthe different devices that are selectively accessible based on queriesusing specific commands in a respective device program for a respectivedifferent device.
 2. The method of claim 1, wherein each page maintainsproperty values for only one device.
 3. The method of claim 1, furthercomprising: returning the first device property information to theprovider.
 4. The method of claim 1, further comprising: invoking aprocess to refresh a selected page at a time interval, wherein theselected page includes device property information for an associateddevice; and setting a timer for the time interval; and executingstatements to query the associated device after the time expires; andrefreshing the selected page with updated device property information inresponse to the query for the associated device.
 5. The method of claim1, wherein each device program includes device specific commands toobtain information to access the device in a network, wherein theinformation to access the device is used by the statements that areexecuted to query the device over the network.
 6. The method of claim 1,further including a properties class for each device including devicespecific commands to obtain information needed to access the device overa network, and wherein the page program comprises a page class ofmethods to access information from the device.
 7. The method of claim 6,wherein an instance of the properties class and page class areinstantiated for each device for which device property information ismaintained in the pages.
 8. The method of claim 1, wherein the deviceprograms are utilized within a Common Information Model (CIM)environment to provide information to CIM clients.
 9. The method ofclaim 1, wherein the different devices are from different vendors. 10.The method of claim 9, wherein the different devices include devices ofa same device type.
 11. The method of claim 1, wherein the devices aredevice types comprising storage systems, application programs, operatingsystems, and computers.
 12. The method of claim 1, wherein the method ofthe factory class is configured to instantiate the device program foreach of the devices.
 13. The method of claim 1, wherein the factoryclass method constructs an instance of a device class response to therequest from the provider.
 14. The method of claim 1, furthercomprising: returning, to the provider, a handle to the first deviceprogram; and calling, with the provider, the first device program forwhich the handle was returned to access the first device propertyinformation from the first page.
 15. A method for enabling access toinformation from a device, comprising: receiving a request for deviceproperty information for a device; generating a device program to accessthe device property information from the device, wherein the deviceprogram includes device specific commands to query the device for thedevice property information and device independent statements common todevice programs for other devices to buffer the queried device propertyinformation to return to requesting clients; accessing, in response tothe request, a device page that maintains the device propertyinformation for the device; and concurrently refreshing the deviceproperty information in the device page and retrieving the deviceproperty information stored in the device page for submission to therequesting client.
 16. The method of claim 15, wherein concurrentlyrefreshing and retrieving the device property information includes:refreshing a first buffer in the device page with updated deviceproperty information for the device; and reading from a second buffer inthe device page previously stored device property information for thedevice, wherein the first and second buffers may each be dynamicallyconfigured to act as a refresh or read buffer based on designatedpointers included in the device page.
 17. A system for accessinginformation on a plurality of different devices in a network,comprising: a computer readable medium; means for receiving a requestfrom a provider for device property information of a first device; meansfor calling a method of a factory class in response to the request,wherein the factory class manages a device program for each of thedifferent devices; means for instantiating a first device program forthe first device, wherein the first device program includes deviceprogram methods that are common in each of the device programs for thedifferent devices; means for calling by the first device program,methods in a page program to access the device property information,wherein the methods in the page program include device specific commandsto query the first device for the device property information; executingstatements in the first device program to query the first device for thefirst device property information; and means for updating a first pagein the computer-readable medium with the first device propertyinformation in response to the query, wherein the computer-readablemedium includes a set of pages that each include device propertyinformation for each of the different devices that are selectivelyaccessible based on queries using specific commands in a respectivedevice program for a respective different device.
 18. The system ofclaim 17, further comprising: means for returning the first deviceproperty information to the provider.
 19. The system of claim 18,further comprising: means for invoking a process to refresh a selectedpage at a time interval, wherein the selected page includes deviceproperty information for an associated device; and means for setting atimer for the time interval; and executing statements to query theassociated device after the time expires; and refreshing the selectedpage with updated device property information in response to the queryfor the associated device.
 20. The system of claim 17, further includinga properties class for each device including device specific commands toobtain information needed to access the device over a network, andwherein the page program comprises a page class of methods to accessinformation from the device.
 21. The system of claim 20, furthercomprising: means for instantiating an instance of the properties classand page class for each device for which device property information ismaintained in the pages.
 22. The system of claim 17, wherein thedifferent devices are from different vendors.
 23. A system for enablingaccess to information from a device, comprising: a computer readablemedium; means for receiving a request for device property informationfor a device; means for generating a device program to access the deviceproperty information from the device, wherein the device programincludes device specific commands to query the device for the deviceproperty information and device independent statements common to deviceprograms for other devices to buffer the queried device propertyinformation to return to requesting clients; means for accessing inresponse to the request, a device page that maintains the deviceproperty information for the device; and means for concurrentlyrefreshing the device property information in the device page andretrieving the device property information stored in the device page forsubmission to the requesting client.
 24. The system of claim 23, whereinconcurrently refreshing and retrieving the device property informationincludes: refreshing a first buffer in the device page with updateddevice property information for the device; and reading from a secondbuffer in the device page previously stored device property informationfor the device, wherein the first and second buffers may each bedynamically configured to act as a refresh or read buffer based ondesignated pointers included in the device page.
 25. A system foraccessing information on a plurality of different devices in a network,comprising: a computer readable medium; at least one processor capableof executing code to perform operations, the operations comprising: (i)receiving a request from a provider for device property information of afirst device; (ii) calling a method of a factory class in response tothe request, wherein the factory class manages a device program for eachof the different devices; (iii) instantiating, by the called factoryclass method, a first device program for the first device, wherein thefirst device program includes device program methods that are common ineach of the device programs for the different devices; (iv) calling, bythe first device program, methods in a page program to access the deviceproperty information, wherein the methods in the page program includedevice specific commands to query the first device for the deviceproperty information; (v) executing statements in the first deviceprogram to query the first device for the first device propertyinformation; and (vi) updating a first page in a computer-readablemedium with the first device property information in response to thequery, wherein the computer-readable medium includes a set of pages thateach include device property information for each of the differentdevices that are selectively accessible based on queries using specificcommands in a respective device program for a respective differentdevice.
 26. The system of claim 25, wherein the operations performed bythe at least one processor further comprise: returning the first deviceproperty information to the provider.
 27. The system of claim 25,wherein the operations performed by the at least one processor furthercomprise: invoking a process to refresh a selected page at a timeinterval, wherein the selected page includes device property informationfor an associated device; and setting a timer for the time interval; andexecuting statements to query the associated device after the timeexpires; and refreshing the selected page with updated device propertyinformation in response to the query for the associated device.
 28. Thesystem of claim 25, further including a properties class for each deviceincluding device specific commands that when executed by the at leastone processor obtain information needed to access the device over anetwork, and wherein the page program comprises a page class of methodsthat when executed by the at least one processor access information fromthe device.
 29. The system of claim 25, wherein the different devicesare from different vendors.
 30. An article of manufacture for accessinginformation on a plurality of different devices in a network, whereinthe article of manufacture causes operations to be performed, theoperations comprising: receiving a request from a provider for deviceproperty information of a first device; calling a method of a factoryclass in response to the request, wherein the factory class manages adevice program for each of the different devices; instantiating, by thecalled factory class method, a first device program for the firstdevice, wherein the first device program includes device program methodsthat are common in each of the device programs for the differentdevices; calling, by the first device program, methods in a page programto access the device property information, wherein the methods in thepage program include device specific commands to query the first devicefor the device property information; executing statements in the firstdevice program to query the first device for the first device propertyinformation; and updating a first page in a computer-readable mediumwith the first device property information in response to the query,wherein the computer-readable medium includes a set of pages that eachinclude device property information for each of the different devicesthat are selectively accessible based on queries using specific commandsin a respective device program for a respective different device. 31.The article of manufacture of claim 30, wherein each page maintainsproperty values for only one device.
 32. The article of manufacture ofclaim 30, further comprising: returning the first device propertyinformation to the provider.
 33. The article of manufacture of claim 30,further comprising: invoking a process to refresh a selected page at atime interval, wherein the selected page includes device propertyinformation for an associated device; and setting a timer for the timeinterval; and executing statements to query the associated device afterthe time expires; and refreshing the selected page with updated deviceproperty information in response to the query for the associated device.34. The article of manufacture of claim 30, wherein each device programincludes device specific commands to obtain information to access thedevice in a network, wherein the information to access the device isused by the statements that are executed to query the device over thenetwork.
 35. The article of manufacture of claim 30, further including aproperties class for each device including device specific commands toobtain information needed to access the device over a network, andwherein the page program comprises a page class of methods to accessinformation from the device.
 36. The article of manufacture of claim 35,wherein an instance of the properties class and page class areinstantiated for each device for which property information ismaintained in the pages.
 37. The article of manufacture of claim 30,wherein the device programs are utilized within a Common InformationModel (CIM) environment to provide information to CIM clients.
 38. Thearticle of manufacture of claim 30, wherein the different devices arefrom different vendors.
 39. The article of manufacture of claim 38,wherein the different devices include devices of a same device type. 40.The article of manufacture of claim 30, wherein the devices are devicetypes comprising storage systems, application programs, operatingsystems, and computers.
 41. The article of manufacture of claim 30,further comprising: wherein the method of the factory class isconfigured to instantiate the device program for each of the devices.42. The article of manufacture of claim 41, wherein the factory classmethod constructs an instance of a device class in response to therequest from the provider.
 43. The article of manufacture of claim 42,further comprising: returning, to the provider, a handle to the firstdevice program; and calling, with the provider, the first device programfor which the handle was returned to access the first device propertyinformation from the first page.
 44. An article of manufacture forenabling access to information from a device, wherein the article ofmanufacture causes operations to be performed, the operationscomprising: receiving a request for device property information for adevice; generating a device program to access the device propertyinformation from the device, wherein the device program includes devicespecific commands to query the device for the device propertyinformation and device independent statements common to device programsfor other devices to buffer the queried device property information toreturn to requesting clients; accessing, in response to the request, adevice page that maintains the device property information for thedevice; and concurrently refreshing the device property information inthe device sage and retrieving the device property information stored inthe device page for submission to the requesting client.
 45. The articleof manufacture of claim 44, wherein concurrently refreshing andretrieving the device property information includes: refreshing a firstbuffer in the device page with updated device property information forthe device; and reading from a second buffer in the device pagepreviously stored device property information for the device, whereinthe first and second buffers may each be dynamically configured to actas a refresh or read buffer based on designated pointers included in thedevice page.
 46. A system for providing device information for differentdevices in a computer network, comprising: a provider configured togenerate a request for device property information for a first deviceincluded in the different devices; and a memory device storing a devicepage including a first device page including the device propertyinformation, the device page including: a first and second buffer, eachbuffer including corresponding fields storing the same device propertyinformation for the first device, a first point identifying either thefirst or second buffer as a buffer used to service the request from theprovider, and a second pointer identifying either the first or secondbuffer as a buffer for receiving refreshed device property informationfrom the first device, wherein the provider, in response to the request,calls methods of a device communication properties class to query adevice communication factory class to access a device communicationobject associated with the first device, wherein the devicecommunication object calls methods of a page class for obtaining thedevice property information from the device page.
 47. A method forproviding access to device property information, comprising: receiving arequest for device property information for a first device from aprovider; accessing a device page including the device propertyinformation in response to the request; and simultaneously, receivingthe device property information from the device page, and refreshing thedevice page with updated device property information.